Specification :
Microarchitecture : K10
Processor core : Kuma
Core stepping : DR-B3
CPUID : 100F23
Manufacturing process : 0.065 micron silicon-on-insulator (SOI) technology
450 million transistors
Die size : 285mm2
Data width : 64 bit
The number of cores : 2
The number of threads : 2
Floating Point Unit : Integrated
Level 1 cache size : 2 x 64 KB 2-way set associative instruction caches
2 x 64 KB 2-way set associative data caches
Level 2 cache size : 2 x 512 KB 16-way set associative caches
Level 3 cache size : Shared 2 MB 32-way set associative cache
Multiprocessing Uniprocessor
Features
MMX instructions
Extensions to MMX
3DNow! technology
Extensions to 3DNow!
SSE / Streaming SIMD Extensions
SSE2 / Streaming SIMD Extensions 2
SSE3 / Streaming SIMD Extensions 3
SSE4a ?
AMD64 / AMD 64-bit technology ?
EVP / Enhanced Virus Protection ?
AMD-V / AMD Virtualization technology
Low power features
Cool'n'Quiet 2.0
CoolCore technology ?
Independent Dynamic Core Technology ?
Dual Dynamic Power Management ?
Integrated peripherals / components
Integrated graphics : None
Memory controller
The number of controllers: 1
Memory channels: 2
Channel width (bits): 64
Supported memory: DDR2-1066
Other peripherals HyperTransport 3.0 technology
Electrical / Thermal parameters
V core ": 1.05V - 1.325V
Maximum operating temperature : 73°C
Thermal Design Power : 95 Watt
Post a Comment